PCCP (VCP) Series

VCP Type Cu Plating Equipment

MSAP,Coreless of PCB ProductionFine Pattern

Application

- HID, PKG ,FPCB

- Panel Fill,Pattern Fill,TH

- Custommization Available: Board Size, Thickness, Lay-out, Capacity, etc

Specification

- Control for Minimizing gaps of panels (※ Anti Back Unit)

- Improving Plating quality via individual DC Current control
(※ Layered Anode)Uniformity : 8㎛ ± 3%

- Minimizing Human Errors
(※ Auto Loading Unit & R/S Auto Make up - System)

- Pointec Holds a number of patents & Know-How about VCP